We offer production systems for deposition of metals, dielectrics  and TCOs using  either evaporation or sputter.   BAK batch evaporators can be optimised for substrate sizes up to 8 inch  including the Auotoload cassette to cassette sytem for elimination of manual wafer handling.  EBS 500 E Gun technology  enables accurate deposition for active, barrier or contact layers  and the addition of PDS plasma source technology enables further reduction of process temperatures or process times . Evatec's Radiance cluster tool offers multiple process technologies on a single platform  ( PVD, RTP, RIE, PECVD, ICP etch) including proven processes.   Evatec sputter  know how enables perfect ohmic contacts for GaN(p) and Forward Voltages in the range 3.0 to 3.2V. whilst ICP etch offers high performance patterning of sapphire .