We  address thin film  hardware and process demands directly for many optoelelectronic applications such as sensors, photovoltaics and LEDs.

We offer production systems for deposition of metals and TCOs either evaporation or sputter.   BAK batch evaporators can be optimised for substrate sizes up to 8 inch optimised including the Auotoload cassette to cassette sytem for elimination of manual wafer handling.  EBS 500 E Gun technology &  PDS plasma source technology  enabling supreme control and repeatability of thickness and film quality for active, barrier or contact layers.

 The  MSP Sputter System. is a dedicated high throughput sputter system for the deposition of layers with supreme optical stabilities.

For production environments demanding a combination of different technologies including sputter, RIE, Microwave and ICP etch as well as PECVD,  Evatec's Radiance cluster tool offers huge flexibility but a compact footprint and proven processes.   Evatec sputter  know how enables perfect ohmic contacts for GaN(p) and Forward Voltages in the range 3.0 to 3.2V. whilst ICP etch offers high performance patterning of sapphire and other typical substrate materials.

Contact your local sales and service office to learn more about Evatec's process solutions.