Lift Off Processes

Evatec specializes in high throughput applications for metal "Lift Off" processes for the III-V market that require the most accurate control of film deposition profile. We offer both batch systems and the Samson split chamber system with the required extended throw geometries.

At the heart of both systems is our high rate, robust Digital Beam Sweep EBS500 Electron Beam Gun with moving crucible cover technology for elimination of cross contamination in special contact metallization applications.

Extended throw geometries

EBS technology eliminates cross contamination

Special application with T Shaped features