SAMSON is a split chamber system where only the substrate chamber is vented during substrate load / unload. The source chamber is kept continually under vacuum and the system is optimised for deposition of highly reactive materials or complex alloying processes where stoichiometry control is critical.

Venting of the substrate chamber enables short extremely short cycle times making the system an ideal choice for high throughput processes on 6 or 8 inch wafers.

Deposition sources available include Evatec’s EBS 500 and Evatec’s high temperature effusion sources with stable control at up to 2000C.