Radiance
Flexible Cluster Tool architecture
Radiance is a flexible tool with cluster architecture for substrate sizes up to 12 inch based around a central transport module with vacuum cassette elevator, robot and load lock. It can be equipped with Evatec’s single or multi process batch modules according to customer throughput and process requirements making it one of the most flexible tools available in the market for optics, semiconductor and optoelectronic applications.
Single modules can be configured for PVD or CVD based deposition, etch or other custom process steps whilst a 6 process position batch module can be equipped for sputter, etch, heating and metrology. Substrate rotation combined with capability for heating or cooling plus fingertip control of source / substrate distance makes the tool an ideal choice for even the most critical process control environments.
Radiance’ system of machined substrate holders gives you flexibility to process differing substrate sizes simultaneously. Alternatively the system can be specified for direct wafer handling.
Contact your local sales office to learn more and configure a Radiance solution that’s right for you.