Overview
The BAK built its name as a standard for a wide range of electronics and semiconductor processes. From the proprietary sublimation and inductively heated sources used in “Under Bump Metallization” (UBM) to the extended throw systems optimised for “Lift Off” processes Evatec offers tailor made hardware solutions. Here are just two of the typical processes which Evatec supports:
All our systems are fully SECS GEM compliant and our local Customer Support Teams around the globe specialize in installation, training and ramp up to ensure consistently high tool uptimes right from tool delivery.
The BAK remains one of the most flexible thin film deposition tools available on the market and ongoing support and upgrade solutions ensures our systems have working lifetimes amongst the highest in the industry.
