We deliver thin film process solutions in our core markets using competences in evaporation, sputter, PECVD and etch technologies.

You can read about the latest production solutions in each of our core markets in our 2017/2018 edition of LAYERS

For immediate help to identify the right platform type for your own particular process requirements and throughput either:

-contact your local sales & service representative or
-complete our Contact Form

Our UBM and RDL processes in Flip Chip, Wafer Level Packaging (WLP) and Fan- in/out Technologies running on CLUSTERLINE® 300 II and HEXAGON platforms deliver outstanding cost of ownership. Panel processing solutions on our new PNL Platform for FOPLP and advanced PCB manufacturing deliver high yield production solutions for substrate sizes up to 550x550mm, whilst SOLARIS is the perfect platform for wafer level EMI shielding processes. READ MORE

From AR coatings to Multibandpass filters, DBRs and TCOs, Evatec solutions using evaporation or sputter on BAK, MSP, CLUSTERLINE® RAD and SOLARIS platforms deliver precision layers for high performance optical interference coatings. Core competences in Advanced Process Control technologies using Broadband Optical Monitoring deliver new levels of quality and yield. READ MORE

Know how in deposition processes for piezoelectric materials, aligned magnetics and dielectrics on a wide range of Evatec platforms according to your production needs enable technologies like Thin Film Heads, on chip inductors, sensors and actuators . Evatec's Advanced Process Control technologies enable new levels of yield in advanced manufacturing approaches including Wafer Level Optics and Microfluidics . READ MORE

Evatec delivers “damage free” thin film processes for LED technologies including GaN on Sapphire, GaN on Si and GaN on GaN . Ask us about high throughput deposition of current spreading layers like ITO, metal contacts and high performance reflectors (DBRs) on platforms like CLUSTERLINE® RAD for the new micro LED technologies too. READ MORE

Our proven portfolio of Front and Backside metallisation and precision "lift off" processes enable Bipolar, MOSFET, IGBT and Wide Band Gap (WBG) technologies. Capabilities including thin wafer processing, in situ stress control and in situ ohmic anneal deliver enhanced yields and reduced process times. READ MORE

Evatec’s comprehensive portfolio of deposition processes for metals, contacts and electrodes, piezoelectric materials and dielectrics enable device technologies including HBT on GaAs, HEMT Technology on GaN, IR devices and RF Filters ( SAW & BAW) READ MORE