From the latest high performance RF switches to the development of the 5G wireless devices our evaporation and sputter platforms support specific thin film processes for wireless communication markets. Best in class thickness and stress uniformities combines with enhanced sources lead to high yields in production for wafer sizes up to 200mm
You can read more about Evatec capabilities in Wireless Communication and all of our other core markets in our new technology magazine LAYERS. To view just the Wireless Communication chapter online click here
The Evatec Wireless Technologies Process Portfolio
Evatec platforms for contact and seed layers deliver reduced precious metals consumption . Ask us about Unicalc. Systems with extended throw are optimised for "lift off" process geometries where subsequent film patterning steps call for zero side wall coverage. Options for full cassette to cassette handling for either evaporation or sputter increases yields , and capability for simultaneous processing of different substrate sizes and recipes maximises tool utilisation on RADIANCE.
SAW and BAW Our thin film processes using evaporation or sputter support the manufacture of existing and next generation low loss RF filters for wireless communication applications. Our BAKs can be custom configured as split chamber extended throw systems for "lift off" or Autoload cassette to cassette handling whilst dedicated cathode technology on our CLUSTERLINE® platform enables the deposition of piezoelectric materials such as AlN and AlScN with a highest degree of crystal orientation and controlled stress for resonators, reflectors and electrodes.
The Evatec tool portfolio for Wireless Communication
Choose from the BAK Evaporator, the RADIANCE sputter cluster, or the CLUSTERLINE® offering sputter, PECVD and etch processes on a single platform configured for formats up to 200mm.