CLUSTERLINE

CLUSTERLINE® PLATFORMS

CLUSTERLINE® is a production proven family of high volume single wafer processing platforms enabling integration of PVD, highly ionised PVD, Soft Etch and PECVD process technologies. Let CLUSTERLINE® do the work- from the deposition of highly aligned magnetic films to high performance AlN for LEDs or Wireless applications to high aspect ratio TSV metallization in Advanced Packaging.

Proven Handling

  • Advanced vacuum, wafer handling and "in-situ" alignment for the most accurate wafer placement in the industry
  • Direct thin wafer handling down to 70microns and 6mm bow , with carrier solutions for even thinner wafers.
  • Bridge or Split Tool Capability.

Proven PVD Knowhow

  • Proven process capabilities in LED, Wireless, BAW/SAW, Thin Film Head, MEMS, Backside metallization and thin wafer processing, Wafer Level Packaginbg and IC Interconnects.
  • Integration of extensive pre and post treatment steps just as you need them.

The CLUSTERLINE® Family

Choose from the CLUSTERLINE® 200 II or the CLUSTERLINE® 300 II . To find out more about the capabilities of each platform click on the links below and download the brochure

Still want to know more?

If you would like to know more about the CLUSTERLINE® Family and its process capabilitiesplease contact your local sales & service representative or complete our Contact Form