CLUSTERLINE® is a production proven family of high volume single wafer processing platforms enabling integration of PVD, highly ionised PVD, Soft Etch and PECVD process technologies. Let CLUSTERLINE® do the work- from the deposition of highly aligned magnetic films to high performance AlN for LEDs or Wireless applications to high aspect ratio TSV metallization in Advanced Packaging.
- Advanced vacuum, wafer handling and "in-situ" alignment for the most accurate wafer placement in the industry
- Direct thin wafer handling down to 70microns and 6mm bow , with carrier solutions for even thinner wafers.
- Bridge or Split Tool Capability.
Proven PVD Knowhow
- Proven process capabilities in LED, Wireless, BAW/SAW, Thin Film Head, MEMS, Backside metallization and thin wafer processing, Wafer Level Packaginbg and IC Interconnects.
- Integration of extensive pre and post treatment steps just as you need them.
The CLUSTERLINE® Family
Choose from the CLUSTERLINE® 200 II or the CLUSTERLINE® 300 II . To find out more about the capabilities of each platform click on the links below and download the brochure