CLUSTERLINE® RAD - Sputter Cluster

Choose CLUSTERLINE® RAD for its automated batch processing capability in LED, MEMS, Wireless and Photonics.

Our new CLUSTERLINE® RAD brochure will be available soon. In the meantime, you can read more about the system architecture below or complete our contact form and we will call you straight back.

Highlights

  • Configured with Batch Process Modules ( BPM) with up to 4 sputter stations and 1 degas / etch position
  • Direct substrate or carrier handling for rapid exchange between substrate formats for flexibility and maximum tool utilisation.
  • Flip system for double sided coating without vacuum break

Platform

-4 sided platform as standard for Integration of BPM with dual load lock at front end.
-Soft etch, heating and cooling capability to enhance your layer quality or protect your substrates.
-Fully "Semi" standards compliant handler compatible with integration of wafer aligner

Process Module / Components

  • BPM with adjustable source to substrate distance, customised chuck and clamp designs e.g. edge grip or full face deposition and heating up to 350C
  • Upstream or downstream process gas control
  • Rotating target technology for high rate and high uniformity in optical interference coatings

Advanced Process Control (APC)

Here are just some of the “in-situ” techniques available on CLUSTERLINE® RAD according to the application and process

  • Plasma Emission Monitoring (PEM) for correct stoichiometry in reactive oxide processes
  • Broadband optical monitoring (GSM) with in situ reoptimisation for the most accurate layer end point termination and overall control of optical performance of optical stacks