LLS EVO II

View the new LLS vertical load lock sputter tool brochure to see how its packed with new features for better uniformity, higher throughput and even lower materials costs.

Features

  • Process flexibility: DC, RF, RF/DC combined, DC pulsed, co-sputtering up to three cathodes
  • Degas and etch in load chamber isolates process chamber from contaminants
  • Easily convertible to various substrate sizes within 5 minutes

Source Capabilities

  • High process flexibility- 5 sources with moveable shutter configurable for DC, RF, pulsed or RF/DC
  • Deposition of metals, dielectrics, TCOs and aligned magnetic film
  • Co-sputtering or continuous phasing

Substrates

  • Easily convertible for different substrate sizes and shapes within 5 minutes
  • Full face deposition or customized edge exclusion, edge masking, shadow masking

  • Batch capacity: ◦ Standard wafer: 2”x 132; 3”x 72; 4”x 36; 5”x 30; 6”x 12; 8”x 9 ◦ Pieces of substrates up to max. 200 x 230mm (9 per batch)

Substrate Thickness

• 2” ≤ 16mm, 3” ≤ 14.5mm, 4” ≤ 13mm, 5” ≤ 11mm, 6” ≤ 8.5mm, 8” ≤ 1.3mm

Substrate Handling

  • Substrate handling at atmosphere
  • Manual or fully automatic 6-axis Robot cassette-to-cassette handling (CTC)
  • Either full face deposition on 125mm, 150mm and 200mm substrates (upon request for 2”, 3” and 100mm substrate diameters) or masked deposition for 200mm substrates
  • Barcode reader optional