PNL Platforms

THE PNL

Evatec's PNL platforms are flexible large area cluster tools for single panel processing of substrate sizes of 550mm x 550mm. They integrates degas, etch and deposition capabilities for Advanced Packaging applications including Fan-Out Panel Level Processing (FOPLP) and advanced PCB manufacturing.

Panel handling at its best

  • Safe handling of large area substrates including an atmospheric front end with alignment and custom quality control integration
  • Static panel etch and deposition processes for best particle control
  • Modular approach with simple access and long maintenance intervals for process sources

Proven Know-how in Degas, Etch and Metals Deposition

  • Leveraging Evatec know-how in low temperature processing of highly outgassing substrates with atmospheric batch degas and arctic etch technologies.
  • Rotating target and moving magnet sputter technologies for high uniformity large area deposition
  • Low temperature processes including deposition of AlN heat spreading layers.

How do i find out more about Evatec solutions for Advanced Packaging applications?

The PNL is one of several solutions available for Advanced Packaging applications including the dedicated HEXAGON and the CLUSTERLINE® 300 II for processes including UBM, RDL and FOWLP or the SOLARIS for chip level EMI shielding.

Want to know more about the PNL or the other tools with sputter capability in the Evatec portfolio?

Please click on the links below, contact your local sales & service representative or complete our Contact Form