Evatec's PNL platforms are flexible large area cluster tools for single panel processing of substrate sizes of 550mm x 550mm. They integrates degas, etch and deposition capabilities for Advanced Packaging applications including Fan-Out Panel Level Processing (FOPLP) and advanced PCB manufacturing.
Panel handling at its best
- Safe handling of large area substrates including an atmospheric front end with alignment and custom quality control integration
- Static panel etch and deposition processes for best particle control
- Modular approach with simple access and long maintenance intervals for process sources
Proven Know-how in Degas, Etch and Metals Deposition
- Leveraging Evatec know-how in low temperature processing of highly outgassing substrates with atmospheric batch degas and arctic etch technologies.
- Rotating target and moving magnet sputter technologies for high uniformity large area deposition
- Low temperature processes including deposition of AlN heat spreading layers.
How do i find out more about Evatec solutions for Advanced Packaging applications?
The PNL is one of several solutions available for Advanced Packaging applications including the dedicated HEXAGON and the CLUSTERLINE® 300 II for processes including UBM, RDL and FOWLP or the SOLARIS for chip level EMI shielding.