Etch

Etch & PIAD Technology

Custom etch technology is available for integration on every platform in the Evatec portfolio. while partner technology company CORIAL offers stand tools for ICP/RIE

From classic metals etch, and high throughput processing of organic substrates in Fanout (FOWLP) to the deposition of thick optical stacks with outstanding adhesion, Evatec delivers custom source and processes for etch and PIAD

Metals Etch

“In situ” etch and dep is available on the BAK Platform . Within the LLS EVO II vertical sputter platform, the load lock chamber can be fitted with degas, heating and RF or ion beam etch for pre cleaning and improved film adhesion. On CLUSTERLINE® our advanced backside metallisation processes on thin wafers include pre etch with control of stress and temperature management for high quality ohmic contact formation without wafer bow or warp

Advanced Packaging

Dedicated ICP Arctic Etch technology available on CLUSTERLINE® and HEXAGON platforms uses cold ICP reactor technology in combination with degas and sputter technologies to achieve stable contact resistance (Rc) values on highly outgassing organic substrates.

PIAD for stable dielectrics

Source technologies on the BAK Evaporator, the RADIANCE Sputter Cluster and the MSP Vertical Sputter in combination with Advanced Process control technologies like Optical Monitoring, Plasma Emission Moinitoring and the In-situ reoptimisataion enable the deposition of stable complex optical layers by evaporation or sputter

Choose your Etch platform

Find out more about Evatec tools and process capabilities by clicking on the links below.

Want to know more?

If you would like to know more about specific etch and PIAD processes available from Evatec please contact your local sales & service representative or complete our Contact Form