TECHNOLOGY OVERVIEW

TECHNOLOGY OVERVIEW

We deliver thin film process solutions in our core markets using our competences in evaporation, sputter, PECVD and etch technologies. Our Advanced Process Control (APC) technologies increase throughput, raise yields and lower cost of ownership.

You can read about how we use our these technologies to delivery production solutions in each of our core markets in our new technology magazine LAYERS

For immediate help to identify the technology type that's right for you according to your application and throughput either:

-contact your local sales & service representative or
-complete our Contact Form

ADVANCED PROCESS CONTROL (APC)
Evatec’s portfolio of “in situ” APC techniques for the precisie control optical, mechanical and electrical film properties shorten process development times, increase yields and reduce costs. READ MORE

ETCH
Etch capability is available across our range of platforms including the BAK Evaporator, the LLS EVO II, the CLUSTERLINE and RADIANCE. Find out how our custom sources enable high performance processes in Advanced Packaging, LED and MEMS. READ MORE

EVAPORATION
From simple boats and filaments to Electron Beam, Effusion Cell and plasma source technology, our evaporation sources ON THE BAK platform delivers enhanced accuracy in layer thickness and superior film performance. Evatec process know how in evaporation technology supports selected applications in Power Devices, MEMS, LED, Compound Semiconductor and Photonics. READ MORE

SPUTTER
Evatec DC, RF, Mixed and Highly Ionised Sputter Source (H.I.S) technologies are available on both cluster and vertical batch platforms supporting processes including MEMS, Power Devices, LED, and Photonics. READ MORE

PECVD
Low maintenance reactor technologies eliminating the need for manual cleaning are available to support processes for MEMS, Photonics and LED. READ MORE