We deliver thin film process solutions in our core markets using our competences in etch, evaporation, sputter and PECVD technologies. Supporting competences in degas technology also enable us to deliver high throughput deposition solutions on highly outgassing organic substrates. Our Advanced Process Control (APC) technologies increase throughput, raise yields and lower cost of ownership.

You can read about how we use our these technologies to delivery production solutions in each of our core markets in the 2018/2019 edition of our technology magazine LAYERS

For immediate help to identify the technology type that's right for you according to your application and throughput either:

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Evatec’s portfolio of “in situ” APC techniques for the precisie control optical, mechanical and electrical film properties shorten process development times, increase yields and reduce costs. READ MORE

Etch capability is available across our range of platforms including the BAK Evaporator, the LLS EVO II, the CLUSTERLINE® family and SOLARIS®. Find out how our custom sources enable high performance processes in applications including Advanced Packaging, LED and MEMS. READ MORE

From simple boats and filaments to Electron Beam, Effusion Cell and plasma source technology, our evaporation sources on the BAK platform delivers enhanced accuracy in layer thickness and superior film performance. Evatec process know how in evaporation technology supports selected applications in Power Devices, MEMS, LED, Compound Semiconductor and Photonics. READ MORE

Evatec DC, RF, Mixed and Highly Ionised Sputter Source (H.I.S) technologies are available on cluster, vertical batch and inline platforms supporting processes including MEMS, Power Devices, LED, Advanced Packaging and Photonics. READ MORE

Reactor technologies are available to support applications including MEMS, Photonics and LED. READ MORE