LAYERS 2017/2018 -Your thin film technology resource
Read about the latest hardware and process developments in each of our core markets in Evatec's technology magazine "LAYERS." View Edition 3 online below including news about our company or view each individual chapter on our individual markets pages
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LAYERS 2017/2018 - Content Overview
- CORPORATE OVERVIEW - Company and technology news from Evatec.
- ADVANCED PACKAGING - Developments in FOWLP, FOPLP and advanced PCB processing
- POWER DEVICES - From "lift off" for WBG to cost down with sputter solutions for bipolar products
- MEMS - Delivering even higher performance in magnetics and piezoelectrics
- WIRELESS COMMUNICATION - Making established evaporation & sputter processes even better
- OPTOELECTRONICS - New challenges in Micro LED technology
- PHOTONICS - From high quality coatings on plastics to new solutions for DLC