As photonics and semiconductor technologies continue to converge, advanced thin-film processes are becoming key enablers for next-generation co-packaged optics (CPO). Join this session to learn how Evatec's comprehensive deposition and process technologies support precision optical components, wafer-level packaging, and high-performance photonic devices. Patrick will also introduce the Evatec Competence Lab (ECL), where universities, research institutes, and industry partners can accelerate innovation from material development and process validation to pilot production.