PVD
Advanced Evaporation and Sputter Technologies
Overview
Benefit from Evatec's long experience in PVD technology with high performance evaporation and sputter sources. Evaporation technology and process know-how is available across the industry standard BAK Family and on selected cluster tools for custom applications. From single or co-sputter to both magnetron and enhanced magnetron technologies, our sputter know-how is available across different source formats to support applications across Advanced Packaging, Semiconductor, Optoelectronics and Photonics.
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Evaporation
Evatec’s know-how in evaporation source and process technology culminates from over 50 years experience starting with the original Balzers BAK electron beam evaporation platforms. In addition to our latest generation digital electron beam gun technology we offer a wide range of additional specialist thermal sources such as barrel sources and effusion cells on our modern BAK platforms built for manual or completely automated loading in a range of standard or extended throw configurations.
Superior thin film properties are achieved by ion beam densification or combined plasma polymerization processes. Sophisticated monitoring techniques including quartz or optical monitoring ensure high precision and reliability.
Click here to view the typical BAK capacity chart. To read more about the BAK family click here
Magnetron Sputter
Evatec has developed a wide variety of proprietary Magnetron Sputter technologies. Each is tailored for specific thin film process requirements - from high throughput backside metallisation processes, to gap filling and planarisation, or low damage deposition on sensitive materials like GaN. Each is optimized for the different machine types:
- arrow_forward DC, for metal sputtering
- arrow_forward DC Pulsed, for reactive as well as for energy-controlled sputtering
- arrow_forward DC High Current Pulsed, for ionized sputtering
- arrow_forward RF, for sputtering of dielectrics
- arrow_forward DC+RF, for energy-controlled sputtering
Linear planar magnetrons are used in batch rotating drum machines (such as our LLS EVO and MSP platforms). Besides their simplicity of design, a long target life and the availability of a wide range of target materials these magnetrons are capable to provide material mixing on the atomic scale. In rotating drum machines, it is also possible to deposit films with anisotropic properties, as it is requested for example in magnetic devices.
Round planar magnetrons are used in machines with:
- arrow_forward Rotating tables (e.g CLUSTERLINE® 200) on platforms equipped with batch process module technology
- arrow_forward Rotating substrates (e.g SOLARIS®)
- arrow_forward Substrate indexing tools (e.g HEXAGON) for static sputtering, as well as
- arrow_forward Cluster type tools (e.g CLUSTERLINE® 200 and 300) for static sputtering
Facing Target Cathode ( FTC) Technology is available on Evatec CLUSTERLINE® platforms and opens up new process possibilities. This Evatec proprietary technology is ideal for challenging deposition processes from damage free deposition of TCOs on sensitive materials like GaN to quasi epitaxial growth of innovative advanced functional materials like BTO and LNO when used in combination with Evatec hot chuck technology.
Multisource sputter technology allows integration of up to 4 smaller sputter sources on a single process flange. It opens up possibilities in co-sputter of alloys / compounds. Ideal for both high speed, cost efficient development of new material composition or mass production, Multisource technology is available on CLUSTERLINE® platforms.
PVD PLATFORMS
We offer a range of batch, cluster or fully automated inline platforms incorporating PVD source technology.
Our experts are on hand to help you find the right platforms according to your process requirements, throughput and factory integration requirements.
BAK FAMILY
Family of evaporators from 0.5 to 1.4 meters for manual or assisted loading offering electron beam evaporation and thermal source technologies. Evatec's new Multi BAK platform also offers possibilities to cluster up to 4 BAK process chambers around an atmospheric front end module with robot for fully automated cassette-to-cassette operation in the highest volume applications.
CLUSTERLINE® 200
Fully automated 200mm cassette-to-cassette cluster platform equipped with single or batch process modules enabling sputter, etch, PECVD and PEALD technologies.
CLUSTERLINE® 300
Fully automated 300mm cluster platform equipped with single process modules offering sputter and etch technologies.
CLUSTERLINE® 600
Advanced Packaging tool for FOPLP and next generation IC substrate sizes up to 650x650mm integrating large area degas, etch and sputter technologies.
HEXAGON
Dedicated platform for advanced packaging applications like FOWLP offering custom degas, etch and sputter technologies on 300mm.
LLS EVO II
Hugely flexible vertical batch sputter platform for simple exchange between different substrate sizes. Ideal for cost effective medium volume production at lower investment costs with a proven track record in the semiconductor industry and available for manual or robot load.
SOLARIS® FAMILY
Family of high speed inline sputter platforms prepared for "fully automated fab" integration. Ideal for the highest volume consumer applications, SOLARIS® platforms are available in two sizes for substate formats up to 8 or 15 inch diagonal.